半導體

半導體

DIE BONDER

編號OB_20220110013933497PLW

已售出

DIE BONDER
DIE BONDER

DIE BONDER

編號OB_20220110013933497PLW
型號AD860
製造商ASM
出廠年份2010
地區桃園市中壢區
面議

設備說明

 XY placement:±1.5 mil(±38.10μm) 
 Die rotation:±3°C 
 cycle time:200 ms material handling capability 
 Die size:6 mil x 6 mil – 50 mil x 50 mil(with PR look ahead) 6 mil x 6 mil – 50 mil x 50 mil(Without PR look ahead) 
 Substrate sizes:Max.(L×W)8" x 5" (203mm×127mm) 

 Pin length:Max.1.42” (36mm) 
 Bond Head System Collet:surface pick type 
 Bond force:30 – 250 g 
 Workholder System No. of Workholders:2 
 Travel range:8’’x 5’’( 203mm×127mm) 
 the image recognition of system Black and white or the 256-level gray range of observation:0.2’’x 0.2’’ 
 Wafer Handling Capabilities Wafer table:Max.travel range7’’x 7’’( 178mm×178mm) 
 Foton ring outer diameter:6’’(152mm) 
 Expanded wafer size:Max.4.7’’(119mm)